Water Beam Machine
Features
- Small heat damage and less burrs
Drop in fracture strength and oxidation of workpiece can be reduced. - No focal length restrictions
Because there are no focal length restrictions, the waterbeam can reach the bottom of even thick workpieces. - Supports a wide range of material
It can process semiconductor materials (Si, GaAs, SiC), metals (stainless steel,
shape memory alloy), ceramics (alumina, low-temperature sintering
substrate) and other materials. - Implementation of high-precision microfabrication
High-precision microfabrication is possible by using an ultrafine waterbeam of a diameter of 10 μm or less and high-functioning drive system.
